Bundle Devices Overview

The overview describes the behavior and usage of bundle devices in the application.

You cannot place every device on a bundle. To be a valid bundle device, the device must be connected directly to any wires with no connector used.

You can use two constraints in relation to the placement of bundle devices on bundles:

• Place bundle device by Attribute/Property Used to specify that the association process places certain types of devices on particular bundles at a specific position (offset from bundle start).

• Minimum Splice Separation Used to specify the minimum distance required between a splice and a bundle device.

If an appropriate “Place bundle device by Attribute/Property” constraint exists on a design, harness, or bundle, the system places a bundle device automatically during the association process or wiring synchronization process. Otherwise, you can place them manually which creates a new constraint automatically.

Caution

During the placement of a bundle device, if constraints are present both on a slot and bundle for the same device, the constraints on the bundle take priority.

You can use a filter to control whether bundle devices are visible on the diagram.

You can also back-annotate the Harness attribute from the bundle device in Capital Wiring Integrator to the device in Capital Logic Designer, according to the name of the harness in which it is located. See Annotating Topology Wire Lengths and Harness Attributes Back to Logical Design Objects.

You can style the appearance of bundle devices using the Device node listed under a Topology style set. See the Capital Diagram Styling User Guide. Any styling specified using that node applies only to bundle devices in Capital Wiring Integrator, not to devices in slots. The bundle device styling is dynamic, that is, when you select a bundle device, the system displays any styled decorations or graphics.

In Capital Wiring Integrator, a Harness report, a Material Statistics report, or a Component BOM report includes bundle devices. In addition, the system includes related constraints in the Applied Constraints report for a Capital Wiring Integrator diagram.

Parent Topic:

Bundle Devices

Capital Logic Designer User Guide, 2512

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